Nordic Semiconductor Tests Bluetooth High Data Throughput in Silicon
Nordic Semiconductor demonstrated silicon-level Bluetooth High Data Throughput (HDT) capabilities on Thursday, October 30, 2026, quadrupling maximum transfer speeds for Bluetooth Low Energy devices. The technological milestone allows developers to deploy high-bandwidth connectivity without altering existing protocols, software tools, or hardware stacks ahead of a planned rollout by the Bluetooth SIG in late 2026.
Chips & export controls: Export controls and industrial policy are direct semis catalysts.